倒圆锥面基底蒸发镀膜均匀性理论分析:倒圆锥面基底蒸发镀膜均匀性理论分析
THEORY STUDY OF FILM THICKNESS DISTRIBUTION ON INVERTED CONICAL SURFACE WITH THE EVAPORATION SOURCE UNDER SUBSTRATE
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作 者:徐嶺茂 王济洲 熊玉卿 何延春
XU Ling-mao, WANG Ji-zhou, XIONG Yu-qing, HE Yan-chun (Science and Technology on Vacuum Technology and Physics Laboratory, Lanzhou Institute of Space Technology and Physics, Lanzhou Gansu 730000, China)
机构地区:兰州空间技术物理研究所真空技术与物理重点实验室,甘肃兰州730000
出 处:《真空与低温》 2014年第20卷第6期 340-343页,共4页
Vacuum and Cryogenics
摘 要:通过计算得出了蒸发源位于倒圆锥面正下方外部镀膜时锥面上各点的膜厚方程,并对整个锥面上膜厚均匀性进行了理论分析。结果表明:当圆锥面形状固定时,蒸发源与圆锥底圆圆心距离增大使锥面上膜厚均匀性变好;当蒸发源固定时,增大底圆半径导致锥面上膜厚均匀性变差。在同样的配置下,蒸发源为点源或小平面源时锥面上膜厚均匀性的变化趋势一致,小平面源蒸镀比点源蒸镀时圆锥面上膜厚均匀性差。
The theory study of film thickness distribution deposited on inverted conical surface with the evaporation source directly below the substrate is reported. The film thickness on every position of the cone and the film thickness uni-formity of the cone can be received by calculation under different geometric configuration. The results show when the evaporation source is point source or small plane source and conical surface shape is fixed,the film thickness uniformity of cone becomes better as the distance of evaporation source and central of the cone bottom. And when the evaporation source is fixed,the increase of cone bottom radius results to film thickness uniformity of cone becomes worse. Under the same configuration,the thickness uniformity of cone with small plane source is worse than point source.
关键词:膜厚分布 倒圆锥面 真空蒸发镀膜
thickness distribution ;inverted conical surface ;film deposition evaporation ;